What are Semiconductor Target Materials?
Target materials include ITO, molybdenum, copper, aluminum, silicon, titanium, tantalum, and various alloys and rare metal targets. They are categorized into planar and rotary targets based on structural form. Coating targets serve as sputtering sources deposited onto substrates under specific process conditions via magnetron sputtering, multi-arc ion plating, or other coating systems to form functional thin films. Simply put, target materials are bombarded by high-speed energetic particles and are used in high-energy laser weapons. Different power densities, output waveforms, and laser wavelengths interacting with different target materials produce distinct damaging effects. For example, evaporative magnetron sputtering coatings involve heating to evaporate coatings such as aluminum films. By changing targets (e.g., aluminum, copper, stainless steel, titanium, nickel), different film systems (e.g., ultra-hard, wear-resistant, anti-corrosive alloy films) can be achieved.
Sandblasting-Thermal Spraying Process for Target Materials
This target treatment method includes the following steps:
Providing a target material with a non-sputtering zone at its edge region.
Sandblasting the surface of the non-sputtering zone to create a rough surface.
Applying thermal spraying to the rough surface to form a coating layer on the non-sputtering zone.
After sandblasting, the non-sputtering zone develops a rough surface. Subsequent thermal spraying forms a coating layer that adheres strongly to the uneven surface, preventing molten powder from rolling off. Compared to sandblasting alone, the combined sandblasting-thermal spraying process significantly enhances the adhesion between the coating and the non-sputtering zone. When applied in vacuum sputtering over extended periods, even if atomic buildup occurs, the coating remains intact, ensuring stable sputtering parameters. This process notably extends the target’s service life, achieving more than a 50% increase in longevity.
High Equipment Requirements for the Process:
Precision Handling: Robots or sandblasting manipulators are required for precise blasting, cleaning, and coverage, ensuring consistent cleanliness, coverage, and uniform roughness.
Versatile Abrasive Compatibility: The equipment must accommodate various ultra-fine abrasives, demanding exceptional stability.
Environmental and Control Standards: High environmental performance is essential, and the equipment control system must be fully digitalized and intelligent.
